Thermal stability of silicide on polycrystalline Si
- Q.Z. Hong
- Stella Q. Hong
- et al.
- 1994
- Thin Solid Films
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122 results for J.M.E. Harper
Intermetallic formation in copper/magnesium thin films - Kinetics, nucleation and growth, and effect of interfacial oxygen
- B. Arcot
- S.P. Murarka
- et al.
- 1994
- Journal of Applied Physics
Giant magnetoresistance in Co/Cu multilayers after annealing
- T.R. McGuire
- J.M.E. Harper
- et al.
- 1994
- Journal of Applied Physics
Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
- E.G. Colgan
- K.P. Rodbell
- et al.
- 1994
- Journal of Applied Physics
Crystallographic texture change during abnormal grain growth in Cu-Co thin films
- J.M.E. Harper
- J. Gupta
- et al.
- 1994
- Applied Physics Letters
Giant magnetoresistance of dilute Cu(Co) granular films
- R.J. Gambino
- T.R. McGuire
- et al.
- 1994
- Journal of Applied Physics
Comparison of high vacuum and ultra-high-vacuum tantalum diffusion barrier performance against copper penetration
- L. Clevenger
- N.A. Bojarczuk
- et al.
- 1993
- Journal of Applied Physics
Stresses and morphological instabilities in silicide/polycrystalline Si layered structures
- Q.Z. Hong
- F.M. D'Heurle
- et al.
- 1993
- Applied Physics Letters
Electrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
Stress development and relaxation in copper films during thermal cycling
- M.D. Thouless
- J. Gupta
- et al.
- 1993
- Journal of Materials Research