Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
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122 results for J.M.E. Harper
Enhanced thermal stability of C49 TiSi2 in the presence of aluminum
- S.-L. Zhang
- F.M. D'Heurle
- et al.
- 1998
- Applied Physics Letters
Copper interconnections and reliability
- C.-K. Hu
- J.M.E. Harper
- 1998
- Materials Chemistry and Physics
Evaluation of Al(Nd)-alloy films for application to thin-film-transistor liquid crystal displays
- H. Takatsuji
- E.G. Colgan
- et al.
- 1998
- IBM J. Res. Dev
Interdiffusion and phase formation in Cu(Sn) alloy films
- L. Clevenger
- B. Arcot
- et al.
- 1998
- Journal of Applied Physics
Low temperature formation of C54-TiSi2 using titanium alloys
- C. Cabral Jr.
- L. Clevenger
- et al.
- 1997
- Applied Physics Letters
Control of in-plane texture of body centered cubic metal thin films
- J.M.E. Harper
- K.P. Rodbell
- et al.
- 1997
- Journal of Applied Physics
Lowering the formation temperature of the C54-TiSi2 phase using a metallic interfacial layer
- C. Cabral Jr.
- L. Clevenger
- et al.
- 1997
- Journal of Materials Research
Microstructure control in semiconductor metallization
- J.M.E. Harper
- K.P. Rodbell
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Reduction of the C54-TiSi2 phase transformation temperature using refractory metal ion implantation
- R. Mann
- G.L. Miles
- et al.
- 1995
- Applied Physics Letters