Publications

25 results for Paul Fortier

Automated Assembly of Duplex Fiber Connectors to Photonic Chips in Standard Microelectronic Tools
- - Ted W. Lichoulas
  - Eddie L. Kimbrell
  - et al.
- 2018
- CLEO 2018
Conference paper
Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
- - Alexander Janta-Polczynski
  - Elaine Cyr
  - et al.
- 2018
- SPIE OPTO 2018
Conference paper
Optoelectronic Chip Assembly Process of Optical MCM
- - Masao Tokunari
  - Koji Masuda
  - et al.
- 2017
- ECTC 2017
Conference paper
Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- - Nicolas Boyer
  - Alexander Janta-Polczynski
  - et al.
- 2017
- ECTC 2017
Conference paper
High-throughput photonic packaging
- - Tymon Barwicz
  - Ted W. Lichoulas
  - et al.
- 2017
- OFC 2017
Conference paper
A polymer waveguide material optimized for on-board optical links and Si photonic interfaces
- - Shotaro Takenobu
  - Kenta Kobayashi
  - et al.
- 2017
- OFC 2017
Conference paper
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2016
- IEEE JSTQE
Paper
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- - Nicolas Boyer
  - Alexander Janta-Polczynski
  - et al.
- 2016
- ECTC 2016
Conference paper
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides
- - Tymon Barwicz
  - Nicolas Boyer
  - et al.
- 2016
- OFC 2016
Conference paper
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2015
- GFP 2015
Conference paper