An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
Conference paper
Publications
25 results for Paul Fortier
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Conference paperSelf-Aligned Polymeric Fiber Interface with 20/mm Port Density and 1.1 dB O-Band Loss
- Alexander Janta-Polczynski
- Tymon Barwicz
- et al.
- 2020
- ECOC 2020
Conference paperAdvances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2020
- IEEE JSTQE
PaperIntegrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing
- Tymon Barwicz
- Bo Peng
- et al.
- 2019
- IEEE JSTQE
PaperMicro lens array assembly for optical organic substrate
- Patrick Jacques
- Richard Langlois
- et al.
- 2019
- ECTC 2019
Conference paperMulti-Wavelength Optical Transceivers Integrated on Node (MOTION)
- Daniel M. Kuchta
- Jonathan E. Proesel
- et al.
- 2019
- OFC 2019
Conference paperSolder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2019
- SPIE OPTO 2019
Conference paperSolder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
Conference paperAutomated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology
Paper