Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Conference paper
Publications
35 results for Mark D. Schultz
Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2016
- ITherm 2016
Conference paperEnthalpy-based system-model for pumped two-phase cooling systems
- Leitao Chen
- Fanghao Yang
- et al.
- 2016
- ITherm 2016
Conference paperEmbedded two-phase cooling of large three-dimensional compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperLocal measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Conference paperEmbedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Conference paperMulticore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Conference paperExperimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center
- Mark Schultz
- Michael Gaynes
- et al.
- 2014
- ITherm 2014
Conference paperDynamically controlled long duration operation of a highly energy efficient chiller-less data center test facility
- Milnes P. David
- Pritish R. Parida
- et al.
- 2013
- InterPACK 2013
Conference paperCooling energy reduction during dynamically controlled data center operation
- Pritish R. Parida
- Timothy J. Chainer
- et al.
- 2013
- InterPACK 2013
Conference paper