Publications

17 results for Keith Kwietniak

Development and characterization of advanced process technologies for the fabrication of crystalline-Si solar cells
- - Satyavolu S. Papa Rao
  - Kate Fisher
  - et al.
- 2010
- PVSC 2010
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- - Chirag S. Patel
  - Cornelia K. Tsang
  - et al.
- 2005
- ADMETA 2005
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- IEDM 2005
BEOL interconnects for 45 nm node and beyond
- - R.R. Yu
  - J. Doyle
  - et al.
- 2005
- VMIC 2005
Assembly technology for three dimensional integrated circuits
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- VMIC 2005
Uniform copper electroplating on resistive substrates
- - Rui Fang
  - Keisuke Namiki
  - et al.
- 2004
- ECS Meeting 2004
Sub-micron platinum electrodes by through-mask plating
- - K.L. Saenger
  - G. Costrini
  - et al.
- 2000
- ECS Meeting 2000
Electrodes and barriers for dram and feram: Processing, integration, and fundamentals
- - K.L. Saenger
  - P.C. Andricacos
  - et al.
- 2001
- MRS Online Proceedings Library
Submicrometer Platinum Electrodes by Through-Mask Plating
- - K.L. Saenger
  - G. Costrini
  - et al.
- 2001
- JES
Pb-free solder alloys for flip chip applications
- - S.K. Kang
  - J. Horkans
  - et al.
- 1999
- ECTC 1999