Development and characterization of advanced process technologies for the fabrication of crystalline-Si solar cells
- Satyavolu S. Papa Rao
- Kate Fisher
- et al.
- 2010
- PVSC 2010
Conference paper
Publications
17 results for Keith Kwietniak
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Conference paperEnabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
Conference paperAssembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Conference paperBEOL interconnects for 45 nm node and beyond
- R.R. Yu
- J. Doyle
- et al.
- 2005
- VMIC 2005
Conference paperUniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Conference paperElectrodes and barriers for dram and feram: Processing, integration, and fundamentals
- K.L. Saenger
- P.C. Andricacos
- et al.
- 2001
- MRS Online Proceedings Library
Conference paperSub-micron platinum electrodes by through-mask plating
- K.L. Saenger
- G. Costrini
- et al.
- 2000
- ECS Meeting 2000
Conference paperSubmicrometer Platinum Electrodes by Through-Mask Plating
- K.L. Saenger
- G. Costrini
- et al.
- 2001
- JES
PaperPb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Conference paper