Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
- Boping Wu
- Xiaoxiong Gu
- et al.
- 2011
- Microwave and Optical Technology Letters
Publications
7 results for Boping Wu
Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2009
- EPEPS 2009
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Full-wave solver for microstrip trace and through-hole via in layered media
- Chong-Jin Ong
- Boping Wu
- et al.
- 2008
- IEEE Transactions on Advanced Packaging