Fast full wave analysis of PCB via arrays with model-to-hardware correlation

This paper applies a methodology based on a mostly-analytical Foldy-Lax full wave scattering model to analyze via arrays in a multilayered printed circuit board. We have demonstrated good model-to-hardware correlation up to 20 GHz by simulating and measuring 8x8 via arrays including 29 signal vias and 35 ground vias in a 18-layer test board. The required CPU in the 64-via case is 4 seconds which is more than four orders of magnitude faster than the market leading general-purpose 3D full wave solver. ©2009 IEEE.