Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
Conference paper
Publications
15 results for T.D. Sullivan
3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
Conference paperReliability of Cu interconnects with Ta implant
- J.P. Gambino
- T.D. Sullivan
- et al.
- 2007
- IITC 2007
Conference paperImproved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Conference paperThreshold electromigration failure time and its statistics for Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- Journal of Applied Physics
PaperApplication of three-parameter lognormal distribution in EM data analysis
- Baozhen Li
- Emmanuel Yashchin
- et al.
- 2006
- Microelectronics Reliability
PaperMinimum void size and 3-parameter lognormal distribution for em failures in Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- IRPS 2006
Conference paperA comprehensive study of low-k SiCOH TDDB phenomena and its reliability lifetime model development
- F. Chen
- O. Bravo
- et al.
- 2006
- IRPS 2006
Conference paperDetermination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
PaperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Conference paper