Extending dual stress liner process to high performance 32nm node SOI CMOS manufacturingM. CaiB. Greeneet al.2008IEEE International SOI Conference 2008
High-performance nMOSFET with in-situ phosphorus-doped embedded Si:C (ISPD eSi:C) source-drain stressorB. YangR. Takalkaret al.2008IEDM 2008
Recent progress and challenges in enabling embedded Si:C technologyB. YangZ. Renet al.2008ECS Meeting 2008
(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineeringB. YangA. Waiteet al.2007IEDM 2007
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithographyS. NarasimhaK. Onishiet al.2006IEDM 2006
Integration and optimization of embedded-SiGe, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologiesM. HorstmannA. Weiet al.2005IEDM 2005
High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOLW.-H. LeeA. Waiteet al.2005IEDM 2005
Dual stress liner enhancement in hybrid orientation technologyC. SherawM. Yanget al.2005VLSI Technology 2005
Dual stress liner for high performance sub-45nm gate length SOI CMOS manufacturingH.S. YangR. Maliket al.2004IEDM 2004