Enhanced electrical and thermal interconnects by the selfassembly of nanoparticle necks utilizing capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2013
- InterPACK 2013
Conference paper
Publications
18 results for Javier V. Goicochea
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- Jonas Zuercher
- Javier V. Goicochea
- et al.
- 2012
- CIPS 2012
Conference paperFormulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Conference paperEnhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
- Javier V. Goicochea
- Thomas Brunschwiler
- et al.
- 2012
- ITherm 2012
Conference paperA multivariate parameter analysis of copper pillars eases the design of denser interconnects
- Gerd Schlottig
- Thomas Brunschwiler
- et al.
- 2012
- EuroSimE 2012
Conference paperUltra-high-concentration photovoltaic-thermal systems based on microfluidic chip-coolers
- M. Müller
- W. Escher
- et al.
- 2011
- CPV 2011
Conference paperFormulation of percolating thermal underfill by sequential convective gap filling
- Thomas Brunschwiler
- Javier V. Goicochea
- et al.
- 2011
- ISHVAC 2011
Conference paperImpact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces
- Javier V. Goicochea
- Bruno Michel
- 2011
- SEMI-THERM 2011
Conference paperSurface functionalization mechanisms of enhancing heat transfer at solid-liquid interfaces
- Javier V. Goicochea
- Ming Hu
- et al.
- 2011
- Journal of Heat Transfer
PaperSignificant reduction of thermal conductivity in Si/Ge core-shell nanowires
- Ming Hu
- Konstantinos P. Giapis
- et al.
- 2011
- Nano Letters
Paper