Heat sink induced thermomechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2014
- Journal of Microelectronics and Electronic Packaging
Publications
11 results for Vijay Khanna
Heat sink induced thermo-mechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2013
- IMAPS 2013
Impact of organic substrate warp on C4 non-wets
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2011
- IEEE Transactions on CPMT
Kinetic heat sink
- Vijay Khanna
- Gerard McVicker
- et al.
- 2010
- IMAPS 2010
Methodology for predicting C4 non-wets during the chip attach process
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2010
- ECTC 2010
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- L. Valdevit
- V.D. Khanna
- et al.
- 2008
- Microelectronics Reliability
A Study of the Head Disk Interface Shock Failure Mechanism
- Suresh Kumar
- Vijay D. Khanna
- et al.
- 1994
- IEEE Transactions on Magnetics
Finite element analysis of a piezoelectrically actuated slider for magnetic recording
- Shuo Hung Chang
- Han Chung Wang
- et al.
- 1991
- IEEE Transactions on Magnetics
Programmable Air Bearing Sliders
- Vijay D. Khanna
- Ferdinand Hendriks
- et al.
- 1991
- IEEE Transactions on Magnetics
Programmable air bearing sliders for magnetic storage
- Vijay D. Khanna
- Ferdinand Hendriks
- 1991
- Tribology Transactions