Publications

20 results for R.D. Goldblatt

Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections
- - A. Deutsch
  - H. Harrer
  - et al.
- 1998
- IEDM 1998
High-performance sub-0.25 μm CMOS technology with multiple thresholds and copper interconnects
- - L. Su
  - R. Schulz
  - et al.
- 1998
- VLSI Technology 1998
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- - J. Heidenreich
  - D. Edelstein
  - et al.
- 1998
- IITC 1998
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- - D. Edelstein
  - J. Heidenreich
  - et al.
- 1997
- IEDM 1997
A time-of-flight static secondary ion mass spectrometry and X-ray photoelectron spectroscopy study of 3-aminopropyltrihydroxysilane on water plasma treated chromium and silicon surfaces
- - B.N. Eldridge
  - L.P. Buchwalter
  - et al.
- 1992
- Journal of Adhesion Science and Technology
An isotope approach to characterization of microwave water plasma modified polyimide surfaces
- - N.J. Chou
  - A.D. Marwick
  - et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Integrity of ceramic packages upon liquid nitrogen cycling
- - Ho-Ming Tong
  - H.L. Yeh
  - et al.
- 1989
- ECTC 1989
Ceramic Packages for Liquid-Nitrogen Operation
- - Ho-Ming Tong
  - Helen L. Yeh
  - et al.
- 1989
- IEEE T-ED
Gold/fluorocarbon adhesion
- - Jae M. Park
  - R.D. Goldblatt
  - et al.
- 1987
- Journal of Adhesion Science and Technology
Mechanism of microwave plasma etching of polyimides in O₂ and CF₄ gas mixtures
- - N.J. Chou
  - J. Parazsczak
  - et al.
- 1986
- Microelectronic Engineering