Measurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Conference paper
Publications
14 results for J. Wakil
Thermal imaging and power mapping at IBM
- Alan J. Weger
- Jamil Wakil
- et al.
- 2012
- ITherm 2012
Conference paperSpatial and temporal thermal characterization of stacked multicore architectures
- Eren Kursun
- Jamil Wakil
- et al.
- 2012
- ACM JETC
PaperMeasurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Conference paperAnalysis of spatial and temporal behavior of three-dimensional multi-core architectures towards run-time thermal management
- Eren Kursun
- J. Wakil
- et al.
- 2010
- ITherm 2010
Conference paperDelamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
Conference paperBEOL thermal characterization for 3-D packaging
- J. Wakil
- E.G. Colgan
- et al.
- 2008
- IMAPS 2008
Conference paperTemperature-limited microprocessors: Measurements and design implications
- Hendrik F. Hamann
- Alan Weger
- et al.
- 2007
- VLSID 2007
Conference paperA practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
PaperHotspot-limited microprocessors: Direct temperature and power distribution measurements
- Hendrik F. Hamann
- Alan Weger
- et al.
- 2007
- IEEE Journal of Solid-State Circuits
Paper