BEOL interconnects for 45 nm node and beyond
- R.R. Yu
- J. Doyle
- et al.
- 2005
- VMIC 2005
Conference paper
Publications
149 results for C. K. Hu
Electromigration in sub-micron Cu interconnects in low k dielectrics
- B.N. Agarwala
- D. Nguyen
- et al.
- 2005
- ECS Meeting 2005
Conference paperElectromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
PaperSuccessful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Conference paperReliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
Conference paperEffects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Conference paperAtom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
PaperEffects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Conference paperEffects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
- R.F. Liu
- C.-K. Hu
- et al.
- 2004
- Journal of Applied Physics
PaperA study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Conference paper