Study of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014
Conference paper
Publications
8 results for Rachel Gordin
TSV multi-signal connection compact modeling
- Essam Mina
- Shlomo Shlafman
- et al.
- 2013
- COMCAS 2013
Conference paperCharacterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- Xiaoxiong Gu
- Joel A. Silberman
- et al.
- 2013
- IEEE Transactions on CPMT
PaperDesign and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT
PaperThe closed environment concept in VLSI on-chip transmission lines design and modeling
- David Goren
- Rachel Gordin
- et al.
- 2006
- IEEE-SPI 2006
Conference paperModeling capacitance of on-chip coplanar transmission lines over the silicon substrate
- Rachel Gordin
- David Goren
- 2004
- IEEE-SPI 2004
Conference paperOn-chip interconnect-aware design and modeling methodology, based on high bandwidth transmission line devices
- D. Goren
- M. Zelikson
- et al.
- 2003
- DAC 2003
Conference paperAn interconnect-aware methodology for analog and mixed signal design, based on high bandwidth (over 40 GHz) on-chip transmission line approach
- David Goren
- Michael Zelikson
- et al.
- 2002
- DATE 2002
Conference paper