TSV multi-signal connection compact modeling

This paper presents wideband circuit level compact models of through-silicon via (TSV) multi-signal connections within an array. The models were developed for time and frequency domain characterization of periodic TSV array patterns, including crosstalk evaluation. A frequency dependent silicon substrate induced dispersion and loss effects are considered, as well as the skin and proximity effects. The models were verified by EM simulations up to 30 GHz. © 2013 IEEE.