Spatially transient stress effects in thin films by X-ray diffraction
- C.E. Murray
- C.C. Goldsmith
- et al.
- 2005
- Powder Diffraction
Paper
Publications
21 results for Charles Goldsmith
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Conference paperImmersion plating of bismuth on tin-based alloys to stabilize lead-free solders
- Emanuel I. Cooper
- Charles C. Goldsmith
- et al.
- 2004
- ECS Meeting 2004
Conference paperFinite size effects in stress analysis of interconnect structures
- I.C. Noyan
- Conal E. Murray
- et al.
- 2004
- Applied Physics Letters
PaperThe microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
PaperThe microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
PaperFormation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Conference paperAg3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
PaperInterfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
PaperAg3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
- Donald W. Henderson
- Timothy Gosselin
- et al.
- 2002
- Journal of Materials Research
Paper