Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
21 results for Charles Goldsmith
Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Conference paperResidual stress properties of nickel and copper deposits used for C4 interconnects
- Charles Arvin
- G.J. Scott
- et al.
- 2011
- ECS Meeting 2011
Conference paperComparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Conference paperThe effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Conference paperEffect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
PaperBlech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
PaperComparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Conference paperEffect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters
PaperThermal stress evolution in embedded Cu/low-k dielectric composite features
- Conal E. Murray
- Charles C. Goldsmith
- et al.
- 2006
- Applied Physics Letters
Paper