A manufacturable dual channel (Si and SiGe) high-k metal gate CMOS technology with multiple oxides for high performance and low power applicationsS. KrishnanU. Kwonet al.2011IEDM 2011
Post-breakdown statistics and acceleration characteristics in high-K dielectric stacksErnest WuJordi Suneet al.2011IRPS 2011
High performance 32nm SOI CMOS with high-k/metal gate and 0.149μm 2 SRAM and ultra low-k back end with eleven levels of copperB. GreeneQ. Lianget al.2009VLSI Technology 2009
Towards a viable TDDB reliability assessment methodology: From breakdown physics to circuit failureErnest Y. WuJordi Suné2009IPFA 2009
Critical Assessment of Soft Breakdown Stability Time and the Implementation of New Post-Breakdown Methodology for ultra-thin gate oxidesE. WuJ. Suñéet al.2003IEDM 2003
A high performance 90 nm SOI technology with 0.992 μm2 6T-SRAM cellMukesh KhareS. Kuet al.2002IEDM 2002
Electrostatic discharge induced oxide breakdown characterization in a 0.1 μm CMOS technologyA. SalmanR. Gauthieret al.2002IRPS 2002
The effect of change of voltage acceleration on temperature activation of oxide breakdown for ultrathin oxidesE. WuJ.M. McKennaet al.2001IEEE Electron Device Letters
Breakdown measurements of ultra-thin SiO2 at low voltageJ.H. StathisA. Vayshenkeret al.2000VLSI Technology 2000