28P L/S Dry Resist Process Flow Co-optimization at Low NA EUV
- Chun-chia Brown Lu
- Saumya Gulati
- et al.
- 2025
- ANS 2025
Publications
7 results for Yann Mignot
Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Dry Resist Characterization Towards Technology Insertion for 28-36P EUV Patterning
- Yasiel Cabrera
- Gopal Kenath
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Exploration of pillar local CDU improvement options for AI applications
- Charlie Liu
- Hao Tang
- et al.
- 2020
- SPIE Advanced Lithography 2020
Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond
- Charlie Liu
- Elliott Franke
- et al.
- 2018
- Nature Electronics