Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
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Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
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- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Electrical characteristics of lossy interconnections for high-performance computer applications
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- SPIE Advances in Intelligent Robotics Systems 1990
RBS analysis of Si diffusion in photoresist during silylation
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The effect of solvent absorption on the electrical and dielectric properties of polyimide films
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A study of the chemical and physical interaction between copper and polyimide
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