Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paper
Publications
6 results for Roy Yu
Effective Media Approximation in Investigating Heat Transfer through Multiple Sandwiched Layers of BEOL Materials
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- SHTC 2025
Conference paperExperimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkA Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Conference paperRole of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- Sari Zerey
- Roy Yu
- et al.
- 2024
- MRS Spring Meeting 2024
Talk