An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
Paper
Publications
14 results for Jun Fan
Modeling of multiple vias with a shared anti-pad in an irregular plate pair using domain decomposition approach
- Yao-Jiang Zhang
- Xiaoxiong Gu
- et al.
- 2014
- EMC 2014
Conference paperBackplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above
- Xiaoxiong Gu
- Young H. Kwark
- et al.
- 2012
- DesignCon 2012
Conference paperAccuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
PaperValidation and application of physics-based via models to dense via arrays
- Xiaoxiong Gu
- Young Kwark
- et al.
- 2011
- DesignCon 2011
Conference paperParametric study on the effect of asymmetry in multi-channel differential signaling
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2011
- EMC 2011
Conference paperInductance calculations for plane-pair area fills with vias in a power distribution network using a cavity model and partial inductances
- Jingook Kim
- Jun Fan
- et al.
- 2011
- IEEE T-MTT
PaperFast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010
Conference paperFully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
- Xiaoxiong Gu
- Francesco De Paulis
- et al.
- 2009
- DesignCon 2009
Conference paperModel-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs
- Arun Reddy Chada
- Young H. Kwark
- et al.
- 2009
- EPEPS 2009
Conference paper