Lid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
Paper
Publications
19 results for Werner Escher
LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015
Conference paperAdvanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
- S. Zimmermann
- H. Helmers
- et al.
- 2013
- CPV 2013
Conference paperPower enhancement of micro thermoelectric generators by microfluidic heat transfer packaging
- N.Z. Wojtas
- E. Schwyter
- et al.
- 2012
- Sensors and Actuators, A: Physical
PaperThermal management and overall performance of a high concentration PV
- Werner Escher
- Stephan Paredes
- et al.
- 2012
- CPV 2012
Conference paperA novel concept of energy reuse from high concentration photovoltaic thermal (HCPVT) system for desalination
- Chin Lee Ong
- W. Escher
- et al.
- 2012
- Desalination
PaperA multivariate parameter analysis of copper pillars eases the design of denser interconnects
- Gerd Schlottig
- Thomas Brunschwiler
- et al.
- 2012
- EuroSimE 2012
Conference paperUltra-high-concentration photovoltaic-thermal systems based on microfluidic chip-coolers
- M. Müller
- W. Escher
- et al.
- 2011
- CPV 2011
Conference paperToward five-dimensional scaling: How density improves efficiency in future computers
- 2011
- IBM J. Res. Dev
PaperPower enhancement of micro thermoelectric generators by micro fluidic heat transfer packaging
- N.Z. Wojtas
- E. Schwyter
- et al.
- 2011
- TRANSDUCERS 2011
Conference paper