Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacksThomas BrunschwilerStephan Paredeset al.2011SEMI-THERM 2011
Heat-removal performance scaling of interlayer cooled chip stacksThomas BrunschwilerStephan Paredeset al.2010ITherm 2010
Hotspot-optimized interlayer cooling in vertically integrated packagesT. BrunschwilerBruno Michelet al.2008MRS Fall Meeting 2008
Forced convective interlayer cooling in vertically integrated packagesThomas BrunschwilerBruno Michelet al.2008ITherm 2008
Interlayer cooling potential in vertically integrated packagesT. BrunschwilerBruno Michelet al.2008Microsystem Technologies