Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Review
Publications
15 results for Bernhard Wunderle
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
Conference paperReview of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Conference paperStress investigations in 3D-integrated silicon microstructures
- M. Stiebing
- Emanuel Lörtscher
- et al.
- 2016
- EuroSimE 2016
Conference paperRe-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016
Conference paperMaster curve synthesis by effective viscoelastic plastic material modeling
- Florian Schindler-Saefkow
- Remi Pantou
- et al.
- 2016
- EuroSimE 2016
Conference paperNanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Conference paperAdvances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
Conference paperExtended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2012
- ITherm 2012
Conference paperFormulation of percolating thermal underfill by sequential convective gap filling
- Thomas Brunschwiler
- Javier V. Goicochea
- et al.
- 2011
- ISHVAC 2011
Conference paper