Future of plasma etching for microelectronics: Challenges and opportunities
- Gottlieb S. Oehrlein
- Stephan M. Brandstadter
- et al.
- 2024
- Journal of Vacuum Science and Technology B
Publications
11 results for Akiteru Ko
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
- Chi Chun Liu
- Richard Farrell
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
The defect mitigation on EUV stack by track based technology
- Naoki Shibata
- Lior Huli
- et al.
- 2019
- SPIE Advanced Lithography 2019
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
Coater/developer based techniques to improve high-resolution EUV patterning defectivity
- Koichi Hontake
- Lior Huli
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
Fin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015