Publications

32 results for Ronald Filippi

Formation of Al-Cu via/interconnect by low-pressure collimated sputtering
- - R.V. Joshi
  - H.M. Dalal
  - et al.
- 1995
- Applied Physics Letters
Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- - H.S. Rathore
  - R. Filippi
  - et al.
- 1992
- SPIE Microelectronic Processing 1992