Publications

32 results for Ronald Filippi

A Highly Reliable Low Temperature Al-Cu Line/Via Metallization for Sub-Half Micrometer CMOS
- - R.V. Joshi
  - H. Dalai
  - et al.
- 1995
- IEEE Electron Device Letters
Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- - H.S. Rathore
  - R. Filippi
  - et al.
- 1992
- SPIE Microelectronic Processing 1992