Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
- A. Grill
- S. Gates
- et al.
- 2008
- IITC 2008
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17 results for S. Gates
Enhanced cracking resistance of plasma deposited low k SiCOH films with nano imbedded layers
- Son Nguyen
- Eric Liniger
- et al.
- 2007
- ECS Meeting 2007
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
A porous SiCOH dielectric with k=2.4 for high performance BEOL interconnects
- S. Gates
- A. Grill
- et al.
- 2006
- ADMETA 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
Evaluation of device damage from e-beam curing of ultra low-k BEOL dielectrics
- S. Mehta
- C. Dimitrakopoulos
- et al.
- 2005
- AMC 2005
Opportunities and challenges in ultra low k dielectrics for interconnect applications
- S. Purushothaman
- S.V. Nitta
- et al.
- 2001
- Technical Digest-International Electron Devices Meeting