Implementing amine-based cleaning chemical for post CMP cleaning of Cu for BEOL interconnect and Hybrid bonding ApplicationsArunkumar G VWei-Tsu Tsenget al.2026ASMC 2026Conference paper
Metal Corrosion Mitigation in Fine Geometries during Chemical Mechanical PlanarizationWei-Tsu TsengEmiko Motoyamaet al.2024ECS Spring Meeting 2024Invited talk
Flowable Chemical Vapor Deposition of Lightly Porous Low k SiCOH Dielectrics—Remote Plasma Deposition Processing, Film Analysis and Gap-Fill Application in Nano Device FabricationSon NguyenThomas Haighet al.2022MRS Fall Meeting 2022Talk