Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
- Adam Pyzyna
- Hsinyu Tsai
- et al.
- 2017
- IITC 2017
Publications
Date
Featured collections
Popular topics
198 results for Christian Lavoie
Impact of laser anneal on NiPt silicide texture and chemical composition
- C. Feautrier
- Ahmet S. Ozcan
- et al.
- 2017
- Journal of Applied Physics
Contacts in advanced CMOS: History and emerging challenges
- Christian Lavoie
- Praneet Adusumilli
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires
- Nicholas A. Lanzillo
- T. Standaert
- et al.
- 2017
- Journal of Applied Physics
Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications
- Sonal Dey
- Kai-Hung Yu
- et al.
- 2017
- JVSTA
Formation of nickel germanides from Ni layers with thickness below 10 nm
- Lukas Jablonka
- Tomas Kubart
- et al.
- 2017
- JVSTB
Texture in thin film silicides and germanides: A review
- B. De Schutter
- K. De Keyser
- et al.
- 2016
- Applied Physics Reviews
Formation and microstructure of thin Ti silicide films for advanced technologies
- Praneet Adusumilli
- A. Carr
- et al.
- 2016
- IITC/AMC 2016
Gas cluster ion beam assisted NiPt germano-silicide formation on SiGe
- Ahmet S. Ozcan
- Christian Lavoie
- et al.
- 2016
- Journal of Applied Physics
Phase formation and texture of thin nickel germanides on Ge(001) and Ge(111)
- B. De Schutter
- K. Van Stiphout
- et al.
- 2016
- Journal of Applied Physics