In-situ characterization of ultrathin nickel silicides using 3D medium-energy ion scattering
- Tuan T. Tran
- Lukas Jablonka
- et al.
- 2020
- Scientific Reports
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Si Incorporation Into AsSeGe Chalcogenides for High Thermal Stability, High Endurance and Extremely Low Vth Drift 3D Stackable Cross-point Memory
- Huai-Yu Cheng
- I. Kuo
- et al.
- 2020
- VLSI Technology 2020
Spin-dependent electron scattering in cobalt interconnects
- Nicholas A. Lanzillo
- P. Bhosale
- et al.
- 2019
- Journal of Physics D: Applied Physics
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
- Nicholas A. Lanzillo
- Benjamin D. Briggs
- et al.
- 2019
- Computational Materials Science
Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs beyond 7nm
- Heng Wu
- Oleg Gluschenkov
- et al.
- 2018
- IEDM 2018
High Performance InGaAs Gate-All-Around Nanosheet FET on Si Using Template Assisted Selective Epitaxy
- S. Lee
- Cheng-Wei Cheng
- et al.
- 2018
- IEDM 2018
Axiotaxy and epitaxial textures in C54-TiSi2 films on Si(0 0 1) and Si(1 1 1) substrates
- F.A. Geenen
- Jean L. Jordan-Sweet
- et al.
- 2018
- Journal of Physics D: Applied Physics
The influence of alloying on the phase formation sequence of ultra-thin nickel silicide films and on the inheritance of texture
- F.A. Geenen
- E. Solano
- et al.
- 2018
- Journal of Applied Physics
Controlling the formation and stability of ultra-thin nickel silicides - An alloying strategy for preventing agglomeration
- F.A. Geenen
- K. Van Stiphout
- et al.
- 2018
- Journal of Applied Physics
Highly-selective superconformai CVD Ti silicide process enabling area-enhanced contacts for next-generation CMOS architectures
- Nicolas Breil
- A. Carr
- et al.
- 2017
- VLSI Technology 2017