Microstructure modulation in copper interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IEEE Electron Device Letters
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144 results for Daniel Edelstein
CVD-Co/Cu(Mn) integration and reliability for 10 nm node
- Takeshi Nogami
- M. He
- et al.
- 2013
- IITC 2013
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James Kelly
- X. Lin
- et al.
- 2013
- JES
Electrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects
- Tibor Bolom
- J. Lee
- et al.
- 2013
- ADMETA 2013
Perspectives into CVD-cobalt liner induced increase in resistivity of Cu interconnect
- Wei Lin
- Xunyuan Zhang
- et al.
- 2013
- ADMETA 2013
Temperature and field interrelation study of low-k TDDB for Cu interconnects with and without liner - New insights to the roles of Cu for a competing breakdown process
- Fen Chen
- Michael Shinosky
- et al.
- 2013
- IRPS 2013
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2013
- Microelectronic Engineering
Materials and scaling effects on on-chip interconnect reliability
- C.-K. Hu
- E. Liniger
- et al.
- 2013
- MRS Spring Meeting 2013
X-ray characterization of PEALD versus PVD tantalum nitride barrier deposition and the impact on via contact resistance
- Xunyuan Zhang
- Oscar Van der Straten
- et al.
- 2013
- ECS Transactions