Topological semimetals for scaled back-end-of-line interconnect beyond Cu
- Ching-Tzu Chen
- Utkarsh Bajpai
- et al.
- 2020
- IEDM 2020
Conference paper
Publications
69 results for Nick Lanzillo
Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- Griselda Bonilla
- Nicholas A. Lanzillo
- et al.
- 2020
- IEDM 2020
Conference paperComprehensive BEOL Performance Assessment: Interconnects Optimized for Signal Routing and Power Delivery in Advanced CMOS Technology Nodes (Invited)
- Nicholas A. Lanzillo
- Rwik Sengupta
- et al.
- 2020
- IITC 2020
Conference paperRole of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
PaperComposite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020
Conference paperFirst-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects
- Timothy M. Philip
- Nicholas A. Lanzillo
- et al.
- 2020
- Physical Review Applied
PaperStructural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- Nicholas A. Lanzillo
- Lawrence Clevenger
- et al.
- 2020
- Journal of Applied Physics
PaperSurface initiated polymer thin films for the area selective deposition and etching of metal oxides
- Thomas G. Pattison
- Alexander E. Hess
- et al.
- 2020
- ACS Nano
PaperChip Power-Frequency Scaling in 10/7nm Node
- Phil Oldiges
- Reinaldo A. Vega
- et al.
- 2020
- IEEE Access
PaperExploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters
Paper