A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology Nodes
- Sagarika Mukesh
- Nicholas A. Lanzillo
- 2023
- IEEE T-ED
Paper
Publications
69 results for Nick Lanzillo
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- APS March Meeting 2023
TalkUnconventional resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- APS March Meeting 2023
TalkMethodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes
- Nicholas A. Lanzillo
- A. Chu
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Conference paperNext-Generation Logic Design Architecture for Vertical-Transport Nanosheets
- Biswanath (Biswa) Senapati
- Jeongho Do
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Invited talkUnconventional resistivity scaling in topological semimetal CoSi
- Shang-Wei Lien
- Ion Garate
- et al.
- 2023
- npj Quantum Materials
PaperSubtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Conference paperSize-Dependent Grain-Boundary Scattering in Topological Semimetals
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2022
- Physical Review Applied
PaperReliability and resistance projections for rhodium and iridium interconnects from first-principles
- Nicholas A. Lanzillo
- Daniel C. Edelstein
- 2022
- Journal of Vacuum Science and Technology B
PaperCapacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- Janet M. Wilson
- Nicholas A. Lanzillo
- 2022
- IITC 2022
Conference paper