Backside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paper
Publications
69 results for Nick Lanzillo
DTCO Guided Process Integration: Case Studies from FEOL & BEOL with BSPDN Topic: DTCO/DFM
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
Conference paperDTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
Conference paperSurface-dominated conductance scaling in Weyl semimetal NbAs
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2024
- npj Computational Materials
PaperTopological semimetal interface resistivity scaling for vertical interconnect applications
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters
PaperApplications of Topological Semimetals for Post-Cu Interconnects
- Ching-Tzu Chen
- Hsin Lin
- et al.
- 2024
- MRS Spring Meeting 2024
Invited talkA novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Conference paperUnconventional Resistivity Scaling in Topological Semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- MRS Spring Meeting 2023
TalkExploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- MRS Spring Meeting 2023
TalkThermal and Electrical Conductivity of Copper-Graphene Heterosystem: An Effect of Strain and Thickness
- Aiswarya Samal
- Anoop Kumar Kushwaha
- et al.
- 2023
- Advanced Engineering Materials
Paper