Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
Publications
35 results for Toyohiro Aoki
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- Kuniaki Sueoka
- Akihiro Horibe
- et al.
- 2015
- 3DIC 2015
Wafer bumping technologies
- Toyohiro Aoki
- 2015
- Journal of the IEICE
Through silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Energy-efficient 1060-nm optical link operating up to 28 Gb/s
- Jean Benoit Héroux
- Tomofumi Kise
- et al.
- 2015
- Journal of Lightwave Technology
Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- IMAPS 2014