Publications

35 results for Toyohiro Aoki

Full intermetallic joints for chip stacking by using thermal gradient bonding
- - T.L. Yang
  - Toyohiro Aoki
  - et al.
- 2016
- Acta Materialia
Paper
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- - Toyohiro Aoki
  - Takashi Hisada
  - et al.
- 2016
- ICEP 2016
Conference paper
Advanced interconnect technologies in the era of cognitive computing
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2016
- Pan Pacific 2016
Conference paper
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- - Jun Mukawa
  - Seiichirou Takahashi
  - et al.
- 2016
- J. Photopolym. Sci. Tech.
Paper
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- - Kuniaki Sueoka
  - Akihiro Horibe
  - et al.
- 2015
- 3DIC 2015
Conference paper
Wafer bumping technologies
- - Toyohiro Aoki
- 2015
- Journal of the IEICE
Paper
Through silicon via process for effective multi-wafer integration
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2015
- ECTC 2015
Conference paper
Energy-efficient 1060-nm optical link operating up to 28 Gb/s
- - Jean Benoit Héroux
  - Tomofumi Kise
  - et al.
- 2015
- Journal of Lightwave Technology
Paper
Development and commercialization of solder bump fabrication technology with molten solder injection method
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
Paper
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2014
- IMAPS 2014
Conference paper