Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

Conference paper

Implementation challenges for scalable neuromorphic computing

Shintaro Yamamichi, Akihiro Horibe, et al.

VLSI Technology 2017

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