Conference paperThermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu PillarTakashi Hisada, Sayuri Kohara, et al.ICEP 2022
Conference paperSolder Injected through Via for Multi Stacked WafersAkihiro Horibe, Kuniaki Sueoka, et al.ECTC 2016
Conference paperThrough silicon via process for effective multi-wafer integrationAkihiro Horibe, Kuniaki Sueoka, et al.ECTC 2015
Conference paperFlip Chip Joining with Injection Molded Solder TechnologyTakashi Hisada, Toyohiro AokiEDTM 2023