Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect

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ICEP-IAAC 2025

Paper

Development and commercialization of solder bump fabrication technology with molten solder injection method

Toyohiro Aoki, Kazushige Toriyama, et al.

J. Jpn. Inst. Electron. Packag.

Conference paper

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

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ECTC 2022

Conference paper

Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology

Toyohiro Aoki, Katsuhiro Yoshida, et al.

ICEP 2021

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