Evaluation of High NA EUV for Subtractive Interconnect Patterning in Advanced NodesChris PennyJoe Leeet al.2026SPIE Advanced Lithography + Patterning 2026
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future ProspectsLuciana MeliIndira Seshadriet al.2025SPIE Advanced Lithography + Patterning 2025