Etching of iridium thin films in chlorine- and fluorine-based inductively coupled plasmas
- Juliano Borges
- Hongwen Yan
- et al.
- 2024
- SPIE Advanced Lithography 2024
Publications
15 results for Jeffrey Shearer
Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Deep learning acceleration in 14nm CMOS compatible ReRAM array: device, material and algorithm co-optimization
- N. Gong
- Malte J. Rasch
- et al.
- 2022
- IEDM 2022
Defect detection strategies and process partitioning for single-expose EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Particle reduction in back end of line plasma-etching process: CFM: Contamination free manufacturing
- Lijuan Zou
- Alex Vaghese
- et al.
- 2018
- ASMC 2018
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
Defect detection strategies and process partitioning for SE EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2018
- SPIE Advanced Lithography 2018
Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
- N. Loubet
- T.B. Hook
- et al.
- 2017
- VLSI Technology 2017
An OCD perspective of line edge and line width roughness metrology
- Ravi Bonam
- R. Muthinti
- et al.
- 2017
- SPIE Advanced Lithography 2017