Publications

20 results for P. M. Vereecken

Electrodeposition of bismuth thin films on n-GaAs (110)
- - Philippe M. Vereecken
  - Kenneth Rodbell
  - et al.
- 2005
- Applied Physics Letters
The chemistry of additives in damascene copper plating
- - Philippe M. Vereecken
  - Robert A. Binstead
  - et al.
- 2005
- IBM J. Res. Dev
Integration of direct plating of Cu onto a CVD Ru liner
- - S. Malhotra
  - D. Canaperi
  - et al.
- 2004
- AMC 2004
Uniform copper electroplating on resistive substrates
- - Rui Fang
  - Keisuke Namiki
  - et al.
- 2004
- ECS Meeting 2004
Liner materials for direct electrodeposition of Cu
- - M.W. Lane
  - C.E. Murray
  - et al.
- 2003
- Applied Physics Letters
Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface
- - M.J. Williamson
  - R.M. Tromp
  - et al.
- 2003
- Nature Materials
Electrodeposition of Bi_1-xSb_x thin films
- - P.M. Vereecken
  - S. Ren
  - et al.
- 2003
- JES
Kinetics of particle codeposition of nanocomposites
- - I. Shao
  - P.M. Vereecken
  - et al.
- 2002
- JES
In situ transmission electron microscopy of copper electrodeposition
- - Frances M. Ross
  - Mark J. Williamson
  - et al.
- 2002
- Microscopy and Microanalysis
Synthesis and characterization of particle-reinforced Ni/Al₂O₃ nanocomposites
- - I. Shao
  - P.M. Vereecken
  - et al.
- 2002
- Journal of Materials Research