Designing porous ultra low-κ dielectrics to meet scaling challenges
- E. Todd Ryan
- Steve Gates
- et al.
- 2011
- ADMETA 2011
Conference paper
Publications
34 results for E. T. Ryan
Optimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- D. Kioussis
- E.T. Ryan
- et al.
- 2011
- IITC/MAM 2011
Conference paperManipulating stress in Cu/low-k dielectric nanocomposites
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Applied Physics Letters
PaperTriaxial stress distributions in Cu/low-k interconnect features
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Applied Physics Letters
PaperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Conference paperEffective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Conference paperSilane decomposition on Cu interconnects inhibited by ammonia
- E. Todd Ryan
- Steven Molis
- et al.
- 2010
- JES
PaperIntegration compatible porous SiCOH dielectrics from 45 to 22 nm
- S. Gates
- A. Grill
- et al.
- 2008
- ADMETA 2008
Conference paperAdjusting the skeleton and pore structure of porous SiCOH dielectrics
- S. Gates
- G. Dubois
- et al.
- 2009
- JES
PaperProperty modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage
- E. Todd Ryan
- Stephen M. Gates
- et al.
- 2008
- Journal of Applied Physics
Paper