Stress determination through diffraction: Establishing the link between Kröner and Voigt/Reuss limits
- Conal E. Murray
- Jean L. Jordan-Sweet
- et al.
- 2015
- Powder Diffraction
Paper
Publications
34 results for E. T. Ryan
Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects
- E. T. Todd Ryan
- Stephen M. Gates
- et al.
- 2014
- Journal of Applied Physics
PaperUV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- N. Inoue
- F. Ito
- et al.
- 2013
- IITC 2013
Conference paperWeighted mechanical models for residual stress determination using x-ray diffraction
- Conal E. Murray
- Stephen W. Bedell
- et al.
- 2013
- Journal of Applied Physics
PaperMitigating residual stress in Cu metallization
- Conal E. Murray
- Jean Jordan-Sweet
- et al.
- 2012
- Applied Physics Letters
PaperTailoring dielectric materials for robust BEOL reliability
- G. Bonilla
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
Conference paperUnderstanding stress gradients in microelectronic metallization
- Conal E. Murray
- E. Todd Ryan
- et al.
- 2012
- Powder Diffraction
PaperEvolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
PaperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
PaperEffective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
Paper