Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
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110 results for Young Kwark
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Chip-to-chip optical interconnects
- J.A. Kash
- F.E. Doany
- et al.
- 2006
- OFC/NFOEC 2006
Terabus: A chip-to-chip parallel optical interconnect
- J.A. Kash
- F.E. Doany
- et al.
- 2005
- LEOS 2005
Electrical / optical high speed scalability link implementation
- D. Kuchta
- C. Baks
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Terabus: A Waveguide-Based Parallel Optical Interconnect
- F.E. Doany
- J.A. Kash
- et al.
- 2005
- FiO 2005
"Terabus" - A waveguide-based parallel optical interconnect for Tb/s-class on-board data transfers in computer systems
- L. Schares
- C.L. Schow
- et al.
- 2005
- ECOC 2005
Issues and challenges of Gbps backplane connector characterization
- Christian Schuster
- Young H. Kwark
- et al.
- 2004
- IEEE-SPI 2004
How detrimental could a via be?
- Lei Shan
- Young Kwark
- et al.
- 2004
- IEEE Topical Meeting EPEPS 2004
Bringing optics inside the box: Recent progress and future trends
- J.A. Kash
- C.W. Baks
- et al.
- 2003
- LEOS 2003