Arun Reddy Chada, Young H. Kwark, et al.
EPEPS 2009
Vias in printed circuit boards and packages are among the components of most concern with respect to signal and power integrity in high-speed communication systems. Recently, the authors have been investigating "physical" or "physics-based" via models, i.e. concise equivalent circuits that accurately reflect the important physical properties of vias. Both topology and element values of a physics-based model have a straightforward correlation to the structure and dimensions of the via, thus enabling a better understanding and scaling. In this paper; the accuracy of the proposed physics-based via models is explored by comparing to measurements and numerical modeling of electromagnetic fields. In addition, the application of physics-based via models to the understanding of the underlying physical phenomena and trends is shown. Copyright © 2006 IMAPS.