Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
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129 results for Eric G. Liniger
Theory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics
Effect of moisture on the Time Dependent Dielectric Breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric
- J.R. Lloyd
- T.M. Shaw
- et al.
- 2005
- IIRW 2005
Lower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- T. Nogami
- S. Lane
- et al.
- 2005
- Optics East 2005
Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics
- J.R. Lloyd
- E. Liniger
- et al.
- 2005
- Journal of Applied Physics
Application of nanoindentation to characterize fracture in ILD films used in the BEOL
- Eva E. Simonyi
- E. Liniger
- et al.
- 2005
- MRS Spring Meeting 2005
Spatial Variations in the Sintering Rate of Ordered and Disordered Particle Structures
- Eric G. Liniger
- Rishi Raj
- 2005
- JACerS
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR