64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
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66 results for Hosadurga Shobha
Extending photo-patternable low-κ concept to 193 nm lithography and e-beam lithography
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2011
- SPIE Advanced Lithography 2011
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Patternable low-κ material for "greener" semiconductor manufacturing
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- ICSICT 2010
Ultrathin (5-35 nm) SiCNH dielectrics for damascene Cu Cap application: Thickness scaling and oxidation barrier performance limitation
- Son Nguyen
- T. Haigh Jr.
- et al.
- 2010
- ECS Meeting 2010
Multi-level integration of patternable low-κ material into advanced Cu BEOL
- Qinghuang Lin
- Shyng-Tsong Chen
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Interactions of metal-organic PEALD TaN with ultra-low k dielectric materials
- O. Van Der Straten
- H. Shobha
- et al.
- 2010
- ECS Transactions