Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
- H. Kim
- C. Detavenier
- et al.
- 2005
- Journal of Applied Physics
Publications
4 results for H. Kim
Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing
- H. Kim
- 2003
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Plasma-enhanced atomic layer deposition of tantalum thin films: The growth and film properties
- H. Kim
- S.M. Rossnagel
- 2003
- Thin Solid Films
Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
- Hyungjun Kim
- A.J. Kellock
- et al.
- 2002
- Journal of Applied Physics