Publications

13 results for Joana Maria

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
Conference paper
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- IBM J. Res. Dev
Paper
3D chip stacking technology with low-volume lead-free interconnections
- - K. Sakuma
  - P. Andry
  - et al.
- 2007
- ECTC 2007
Conference paper